Lok-kun Tsui1, John Plumley1, Thomas Peng2, Fernando Garzon1
- University of New Mexico
- Air Force Research Laboratory
The additive manufacturing of solid-state ion conductors opens the possibility to fabricate novel electrochemical devices at small-scales for rapid prototyping. Resistive switching devices based on conductive bridging are a promising technology for next generation reconfigurable electronics, particularly in satellite electronics where radiation hardness is a desirable property. Electrochemically driven growth of a metal filament from the cathode to the anode through a solid-state ionic conductor is used to switch the device from a low conductivity state to a high conductivity state. We have deposited Pt/AgI/Ag electrochemical cells as a proof of concept that such solid-state electrolytes can be produced by additive manufacturing. The AgI electrolyte is deposited by computer controlled extrusion of a paste and the electrodes are deposited by vapor deposition.During filament formation AgI acts as an Ag+ ion conductor, Pt is the cathode, and Ag is the anode. The resistance of the device is found to reversibly switch across three orders of magnitude in transitions from the high to low resistance states. Impedance measurements were also performed to evaluate the conductivity of the device at elevated temperatures.