Solder cup quality effects on properties

Lisa Deibler, Michael Heiden, Shelley Williams, Rand Garfield, John Laing

Sandia National Laboratories

Connectors rely on solder joints to transfer electricity between wires and hard pins that can easily be mated and de-mated. A typical solder joint configuration is a cup-shaped receptacle with a wire inserted into it. We desire to know to what extent the quality of the solder joint may factor into potential failures of the connector, given that connectors encounter vibration and shock throughout their lifetime. In this work we have measured the quality of a solder joint after vibration and shock testing, and compared the results with the load-displacement data obtained from pull-testing each individual joint. We have inspected the fracture surfaces of the ruptured samples to determine what led to each failure mode that was found to occur.

Sandia National Laboratories is a multi-mission laboratory managed and operated by National Technology and Engineering Solutions of Sandia, LLC., a wholly owned subsidiary of Honeywell International, Inc., for the U.S. Department of Energy’s National Nuclear Security Administration under contract DE-NA0003525.