2022 RGSAM

Unfortunately, due to Covid-19 concerns, the 2021 Rio Grande Symposium on Advanced Materials has been canceled. 

We have tentatively planned the next RGSAM for October 24th, 2022 in Albuquerque (Location to be announced).



The 31st Rio Grande Symposium on Advanced Materials was held September 16th, 2019 at the Hotel Albuquerque, 800 Rio Grande Blvd NW, Albuquerque, NM 87104.

The ASM Albuquerque Chapter may reimburse registration fees for students who present a talk or poster. You must approach the registration desk at the end of the conference to receive reimbursement.

The Rio Grande Symposium on Advanced Materials (RGSAM) is a general technical meeting of materials researchers in the Rio Grande geographic region. It is an outgrowth of the Joint Technical Meetings of the New Mexico Section of the American Ceramic Society and the New Mexico Section of the Materials Research Society initiated in 1989. These meetings, sub-titled “Ceramics and Advanced Materials: Symposia and Poster Session,” proved to be quite popular among materials researchers in the Rio Grande geographic region. Attendance typically ranged between 75 and 150 people presenting 30 to 50 presentations, which were frequently used as a local warm-up for national meetings. An important aspect of this symposium is that it has been, and continues to be a venue for presentations by students from regional universities. In 1997, the Albuquerque Chapter of ASM International joined with the NM Section of the American Ceramics Society to host the meeting which began its new name, “The Rio Grande Regional Symposium on Advanced Materials.” Reflecting the multidisciplinary nature of materials research presented at RGSAM, other societies soon joined to host the symposium. The New Mexico Chapter of the American Vacuum Society organized the RGSAM in 2013, followed by the Central New Mexico Local Section of the American Chemical Society in 2015. In 2018, the Albuquerque Chapter of ASM organized. This meeting hopes to reach out to a broad base of support among local materials societies and will be a focal point for the exchange of technical information in the Rio Grande geographic region well into the 21st century.


Kreidl Lecture


Norbert J. Kreidl


At the core of this meeting is the Kreidl Memorial Lecture, honoring the career achievements of Norbert Kreidl, a remarkable and indefatigable glass scientist who spent his final years as a consultant based in Santa Fe, New Mexico.


The Kreidl Lecture has featured several prominent ceramists and glass scientists.


Kreidl Lecturer


Mark C. Hersam, Walter P. Murphy Professor of Materials Science and Engineering, Department of Materials Science and Engineering, Northwestern University


Mark C. Hersam


Mark C. Hersam is the Walter P. Murphy Professor of Materials Science and Engineering and Director of the Materials Research Center at Northwestern University. He also holds faculty appointments in the Departments of Chemistry, Applied Physics, Medicine, and Electrical Engineering. He earned a B.S. in Electrical Engineering from the University of Illinois at Urbana-Champaign (UIUC) in 1996, M.Phil. in Physics from the University of Cambridge (UK) in 1997, and a Ph.D. in Electrical Engineering from UIUC in 2000. His research interests include nanomaterials, nanomanufacturing, scanning probe microscopy, nanoelectronic devices, and renewable energy. Dr. Hersam has received several honors including the Presidential Early Career Award for Scientists and Engineers, TMS Robert Lansing Hardy Award, AVS Peter Mark Award, MRS Outstanding Young Investigator, U.S. Science Envoy, MacArthur Fellowship, and eight Teacher of the Year Awards. An elected member of the National Academy of Inventors, Dr. Hersam has founded two companies, NanoIntegris and Volexion, which are commercial suppliers of nanoelectronic and battery materials, respectively. Dr. Hersam is a Fellow of MRS, AVS, APS, AAAS, SPIE, and IEEE, and also serves as an Associate Editor of ACS Nano.


Kreidl Lecture Abstract


Mixed-Dimensional van der Waals Heterostructures for Electronic and Energy Applications


Mark C. Hersam, Department of Materials Science and Engineering, Northwestern University


            Layered two-dimensional (2D) materials interact primarily via van der Waals bonding, which has created new opportunities for heterostructures that are not constrained by epitaxial growth [1]. However, it is important to acknowledge that van der Waals interactions are not limited to interplanar interactions in 2D materials. In principle, any passivated, dangling bond-free surface interacts with another via non-covalent forces. Consequently, layered 2D materials can be integrated with a diverse range of other materials, including those of different dimensionality, to form mixed-dimensional van der Waals heterostructures [2]. Furthermore, chemical functionalization provides additional opportunities for tailoring the properties of 2D materials [3] and the degree of coupling across heterointerfaces [4]. In order to efficiently explore the vast phase space for mixed-dimensional heterostructures, our laboratory employs solution-based additive assembly [5]. In particular, constituent nanomaterials (e.g., carbon nanotubes, graphene, transition metal dichalcogenides, black phosphorus, boron nitride, and indium selenide) are isolated in solution, and then deposited into thin films with scalable additive manufacturing methods (e.g., inkjet, gravure, and screen printing) [6]. By achieving high levels of nanomaterial monodispersity and printing fidelity [7], a variety of electronic and energy applications can be enhanced including digital logic circuits [8], photodetectors [9], and lithium-ion batteries [10,11]. Furthermore, by integrating multiple nanomaterial inks into heterostructures, unprecedented device function is realized including anti-ambipolar transistors [12], gate-tunable photovoltaics [13], and neuromorphic memtransistors [14]. In addition to technological implications for electronic and energy technologies, this talk will explore several fundamental issues including band alignment, doping, trap states, and charge/energy transfer across previously unexplored mixed-dimensional heterointerfaces [15].


  • [1] X. Liu, et al., Advanced Materials, 30, 1801586 (2018).
  • [2] D. Jariwala, et al., Nature Materials, 16, 170 (2017).
  • [3] C. R. Ryder, et al., Nature Chemistry, 8, 597 (2016).
  • [4] S. H. Amsterdam, et al., ACS Nano, 13, 4183 (2019).
  • [5] J. Zhu, et al., Advanced Materials, 29, 1603895 (2017).
    [6] G. Hu, et al., Chemical Society Reviews, 47, 3265 (2018).
  • [7] J. Kang, et al., Accounts of Chemical Research, 50, 943 (2017).
  • [8] M. Geier, et al., Nature Nanotechnology, 10, 944 (2015).
  • [9] J. Kang, et al., Advanced Materials, 30, 1802990 (2018).
  • [10] K.-S. Chen, et al., Nano Letters, 17, 2539 (2017).
  • [11] W. J. Hyun, et al., ACS Nano, DOI: 10.1021/acsnano.9b04989 (2019).
  • [12] V. K. Sangwan, et al., Nano Letters, 18, 1421 (2018).
  • [13] D. Jariwala, et al., Nano Letters, 16, 497 (2016).
  • [14] V. K. Sangwan, et al., Nature, 554, 500 (2018).
  • [15] S. B. Homan, et al., Nano Letters, 17, 164 (2017).


Prior Kreidl Lecturers


William D. Kingery, University of Arizona
Delbert E. Day, University of Missouri – Rolla
Arthur H. Heuer, Case Western Reserve University
Don L. Kendall, University of New Mexico
David A. Payne, University of Illinois – Urbana-Champaign
Joseph H. Simmons, University of Florida
Robert E. Newnham, Penn State University
Anthony F. Giamei, United Technologies Research Center
Gary Messing, Penn State University
Anthony G. Evans, Princeton University
Zhigang Suo, Princeton University
Nathan S. Lewis, California Institute of Technology
Subra Suresh, Massachusetts Institute of Technology
Robert O. Ritchie, Lawrence Berkeley National Laboratory
David R. Clarke, University of California at Santa Barbara
Steve Brueck, University of New Mexico
John Parise, SUNY Stony Brook
Kurt Sickafus, Los Alamos National Laboratory
Richard LeSar, Iowa State University
Uzi Landman, Georgia Institute of Technology
Carlo Pantano, Penn State University
Harry Atwater, California Institute of Technology
Diana Farkas, Virginia Tech
Michael J. Cima, Massachusetts Institute of Technology
Ray Baughman, University of Texas at Dallas
Carol Handwerker, Purdue University
Paul S. Weiss, University of California, Los Angeles